Adrian
New member
During the assembly of the hardware I came across directions concerning the plate choke wires that I would like some clarification on.
The instructions on page 17 have me cut the BLACK lead to 1" and install some heat shrink over it (not shown in photo).
Questions:
1. Is the Plate Choke BLACK lead ever used in this application (S.E.X. 2.1)? (I can't find anywhere in the instructions where it is used, but could it be used later?)
2. Why the heat shrink?
Is this additional insulation?
Should it be longer than the 1" cut black lead?
Also, the simplified schematic on page 7 shows three (3) B+ Choke connections. One of these connections is on only one (1) channel power supply on the negative (-) side of the 100 microfarad capacitor. This appears to be connected directly to ground. Is this correct, or a misprint?
The instructions on page 17 have me cut the BLACK lead to 1" and install some heat shrink over it (not shown in photo).
Questions:
1. Is the Plate Choke BLACK lead ever used in this application (S.E.X. 2.1)? (I can't find anywhere in the instructions where it is used, but could it be used later?)
2. Why the heat shrink?
Is this additional insulation?
Should it be longer than the 1" cut black lead?
Also, the simplified schematic on page 7 shows three (3) B+ Choke connections. One of these connections is on only one (1) channel power supply on the negative (-) side of the 100 microfarad capacitor. This appears to be connected directly to ground. Is this correct, or a misprint?